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Packaging and Characterization Certificate Program

State-of-the-art technologies, processes, and tools

The semiconductor packaging and characterization certificate program prepares students for careers in the semiconductor and electronics industry by teaching the principles of semiconductor packaging.

Students will learn about the fundamental electrical, thermal, reliability, and materials considerations and trade-offs, and state-of-the-art technologies, processes, and tools. The courses will consist of two to three asynchronous lectures and one in-person lab per week. Labs will be held at the Virginia Tech Research Center in Arlington, Virginia.


The packaging certificate program will be 10 weeks and will include 60 hours of asynchronous online lectures, and 40 hours of hands-on, in-person lab training. The course consists of 4 modules:

  • Packaging components, materials, and processes
  • Electrical design
  • Thermal design
  • Reliability


Students will learn how to design, build, and test semiconductor packages through simulation tools and gain hands-on packaging experience in labs using state-of-the-art equipment.

Having successfully completed this program, students will be able to:

  • Design basic architecture and layout of a semiconductor package
  • Analyze the electrical and thermal characteristics of a semiconductor package
  • Select appropriate materials and processes for the fabrication of a semiconductor package
  • Fabricate and characterize a semiconductor package using state-of-the-art equipment
  • Determine failure mechanisms and reliability for a semiconductor package.

Roles You’ll Be Ready For

Participants will be ready for entry-level engineering and technician positions in the semiconductor packaging industry following the completion of the program.

Ready to Get Started?