Packaging and Characterization Certificate Program
The semiconductor packaging and characterization certificate program prepares students for careers in the semiconductor and electronics industry by teaching the principles of semiconductor packaging.
The semiconductor packaging and characterization certificate program prepares students for careers in the semiconductor and electronics industry by teaching the principles of semiconductor packaging. Students will learn about fundamental electrical, thermal, and material properties of these devices and how to consider reliability issues. They will apply these in a lab with state-of-the-art technologies, processes, and tools through hands-on operation, applications, and maintenance/repair. Labs are typically held at the Virginia Tech Research Center in Arlington, Virginia.
Choose Your Learning Path:
- Path A: Hands-on training with lab experience (80 hours total)
- Path B: Comprehensive theory lectures only (40 hours total)
- Path C: Hands-on training only - requires Path B completion (40 hours total)
Our Certificates Are Now Backed by
IEEE Microcredentials
NEW! We are proud to announce our first ever online only version of the FTSC Program (Lectures Only - Path B). With this program, students who are not available to take in-person classes during the session can take the first half of the certificate program remotely. A full certification will require in-person, hands-on lab only portion, which is also available now. See below tab for more details.
Choose the Right Path for Your Goals
| Path A: Lectures + Labs | Path B: Lectures Only | Path C: Labs Only | |
|---|---|---|---|
| Total Hours | 80 hours (40 lectures + 40 labs) | 40 hours (lectures only) | 40 hours (labs only) |
| Lab Access | ✅ State-of-the-art equipment training | ❌ No hands-on component | ✅ Extensive hands-on training |
| Prerequisites | High School Diploma | High School Diploma | Successful completion of Path B |
| Career Focus | Entry-level technician and engineering roles | Research, support, and theoretical roles | Entry-level technician and engineering roles |
| Tuition | $5,000 ($2,000 students/teachers) | $2,000 ($700 students/teachers) | $3,000 ($1,500 students/teachers) |
PATH A - LECTURES + LABS
Students will learn how to design, build, and test semiconductor packages and gain hands-on experience in labs using and maintaining state-of-the-art equipment.
Having successfully completed this program, students will be able to:
- Design basic architecture and layout of a semiconductor package
- Analyze the electrical and thermal characteristics of a semiconductor package
- Select appropriate materials and processes for the fabrication of a semiconductor package
- Fabricate and characterize a semiconductor package using state-of-the-art equipment
- Determine failure mechanisms and reliability for a semiconductor package
- Understand basic maintenance and repair practices for lab equipment
The courses will consist of two asynchronous lectures and one in-person lab per week.
Labs will be held at these two locations:
Virginia Tech Research Center, Arlington
- Lab Option 1: Thursdays 8am-12 pm
- Lab Option 2: Thursdays 3pm-7pm
Questions? Please contact us at info@vast-alliance.org
PATH B - LECTURES ONLY
Students will learn about the fundamental electrical, thermal, reliability, materials considerations and tradeoffs, and state-of-the-art technologies, processes, and tools. Virtual demonstrations of laboratory processing and characterization will accompany the lecture discussions.
Having successfully completed this program; students will be able to:
- Understand fundamental concepts and terminology associated with semiconductor packaging
- Evaluate different semiconductor packaging options, based on electrical, thermal, and physical requirements
- Understand the various laboratory processes associated with the fabrication and characterization of semiconductor packaging<
The courses will consist of two to three asynchronous lectures and one virtual lab demonstration per week.
Lectures: Asynchronous, requiring completion of specific modules every week.
Questions? Please contact us at: info@vast-alliance.org
Path C: Extensive Hands-On Training (Requires Path B Completion)
What You'll Learn:
- Design basic architecture and layout of semiconductor packages
- Analyze electrical and thermal characteristics of packages
- Select appropriate materials and fabrication processes
- Fabricate and characterize packages using state-of-the-art equipment
- Determine failure mechanisms and reliability issues
- Perform basic maintenance and repair of lab equipment
Agenda/Schedule
10-Week Curriculum:
The certificate program will be 10 weeks and will include up to 40 hours of hands-on, in-person lab training. The course consists of 10 modules:
- Packaging components, materials, and processes
- Electrical design
- Thermal design
- Reliability
- Lab equipment operations, maintenance and repair
Labs will be held in person at multiple locations in Virginia. Labs may also be available multiple times. Choose one lab option during registration.
Lab Locations:
Labs will be held at these two locations:
Virginia Tech Research Center, Arlington
- Lab Option 1: Thursdays 8am-12 pm
- Lab Option 2: Thursdays 3pm-7pm
Questions? Please contact us at info@vast-alliance.org
Discounts Offered
*May be required to show a valid ID with your status as student, teacher or military connected for all discounts.
Roles You’ll Be Ready For
Participants who have successfully completed the full certification will be ready for entry-level engineering and technician positions in the semiconductor, nanotechnology and microelectronics industry after the program is completed.
Those who have only completed Path B will be prepared for roles that require a theoretical understanding of semiconductor fabrication, including positions in semiconductor manufacturing, research, and support roles.
Lab training for this cohort will be available at:
